VIA hole punching
Sheet stacking
Press/Laminating System
Global standard press and bonding system for multilayered electronic components
Sheet cutting
| Application | Image | Problem | Results | Products |
|---|---|---|---|---|
| Sample solutions | ||||
| MLCC, MLCI PIEZO, LTCC, HTCC |
 |
Delamination | Improved blocking capability Improved yield Improved productivity |
|
| Isostatic pressing Uniform heating |
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| MEMS Package IC Package |
 |
Shear drop of the cavity corner | Eliminated shear drops Improved accuracy of the dimensions |
|
| Isostatic pressing Uniform heating |
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| LED Package |  |
Complex shapes | Improved productivity Improved accuracy of dimensions |
|
| Forming trapezoid mold cavity | ||||
| LTCC, HTCC |  |
Long time for punching | 100,000 holes/90 sec. | |
| High-speed precise collective punching | ||||
| PIEZO, FILTER LTCC, HTCC |
 |
Low precision of the stack | Stack accuracy: ± 10 μm error |
|
| Precise stacking | ||||
| Fuel cell, SOFC |  |
Cracking and chipping during cylinder forming | Improved mechanical and thermal strength | |
| Isostatic pressing | ||||
| ACF Bonding |  |
Long bonding time | Bonding multiple parts in a few seconds | |
| High-speed collective bonding | ||||
| Lamination of resin sealing film |  |
Void spaces | Simple and reliable insulation protection | |
| Voidless lamination | ||||
| Film lamination on filxible board |  |
Void spaces and cracking | High weather resistance | |
| Uniform pressure lamination Voidless lamination |
Precision Equipment Business Division
Fine Ceramic Component Manufacturing Equipment Department
Phone: +81-42-392-3372 / Fax: +81-42-392-3362
