Warm Laminating System
This product is also known as a warm isostatic press (WIP).
Warm laminating system is a global standard for sheet lamination of high guality multi-layer ceramic electronic components like MLCC, MLCI, LTCC, HTCC, MCM, PZT, Filter or varistor etc.
Applications
- Press bonding of multilayered ceramic condensers
- Press bonding of alumina multi-layer printing boards
- Press bonding of IC packages
- Press bonding of other laminated electronic components
Feature
- Uniform, 3-dimentional isostatic pressing
- Uniform temperature
- High productivity
- Uniform pressure act on uneven sheet
Standard specifications
Specifications of the Nikkiso WIP can be customised according to customer needs. The following table lists key specifications. Other special specifications can be custom-made, so feel free to contact us with your specific requirements.
| Model | Vessel inside dimensions | Maximum working pressure | Maximum working temperature |
|---|---|---|---|
| WL24-26-50 WL28-45-50 WL31-43-50 WL38-80-50 WL40-50-50 |
φ240mm×260mmL φ280mm×450mmL φ310mm×430mmL φ380mm×800mmL φ400mm×500mmL |
49.0 MPa | 90ºC (pressure medium is water) 120ºC (pressure medium is oil) |
| WL15-50-200 WL32-28-200 |
φ150mm×500mmL φ320mm×280mmL |
196 MPa |
Demonstration unit
The demonstration unit is available in Nikkiso's Higashi Murayama Plant. Please feel free to contact us for a demonstration.
Model with automatic transportation mechanism
By independently setting the workset, preheating and forming positions, the tact time can be shortened dramatically.
Standard specifications
| Model | Vessel inner dimensions |
|---|---|
| AWL32-29-200 | φ320mm×290mmL |
| Maximum working pressure | Maximum working temperature |
| 196 MPa | 90ºC |
Precision Equipment Business Division
Fine Ceramic Component Manufacturing Equipment Department
Phone: +81-42-392-3372 / Fax: +81-42-392-3362
