Heatless Dryer
HLK heatless dryer (low-flow)

HLK type heatless driers are compact heatless dryers designed for low flow.
The dryers are most desirable not only for industry usage but also for analysis processes and R&D in laboratories.
Reference specifications
Dew point temperature | -73°C (under pressure) | -40°C (under pressure) |
---|---|---|
Inlet air flow | ∼700 NL/min | ∼1,100 NL/min |
Inlet air pressure | 0.41∼0.97MPa | 0.41∼0.97MPa |
Inlet air temperature | 10∼49°C | 10∼49°C |
CDA/DHA heatless dryer (medium-flow)

CDA/DHA heatless dryers are suited not only for instrumentation air in process control but also for a wide variety of industry applications including powder pumping, coating spray, and N2 alternative air in semiconductor manufacturing process.
Features
- Dryer-specific poppet valves are developed and used.
- Continuous supply of air in case of power shutdown (no problem in the event of a power outage).
- Absorbent with super-long life is employed.
- Easy checking of conditions from the liquid crystal display system indication (when ADCBOX is selected).
- With the adoption of dedicated valves, the purge flow rate is 14.8% (at 0.69 MPa), which is the limit level of the heatless dryer.
- The purge flow is controlled to an proper value by an AMLOC energy saving system according to the flow load.
Reference specifications
Dew point temperature | -73°C (under pressure) | -40°C (under pressure) |
---|---|---|
Inlet air flow | ∼37 Nm3/min | ∼38 Nm3/min |
Inlet air pressure | 0.41∼0.99MPa | 0.41∼0.99MPa |
Inlet air temperature | 10∼49°C | 10∼49°C |
CHA heatless dryer (high-flow)

CDA/DHA heatless dryers are suited not only for instrumentation air in process control but also for a wide variety of industry applications including powder pumping, coating spray, and N2 alternative air in semiconductor manufacturing process.
Features
- Dryer-specific century valves are developed and used.
- Continuous supply of air in case of power shutdown (no problem in the event of a power outage).
- Absorbent with super-long life is employed.
- Easy checking of conditions from the liquid crystal display system indication (when ADCBOX is selected).
- With the adoption of dedicated valves, the purge flow rate is 14.8% (at 0.69 MPa), which is the limit level of the heatless dryer.
- The purge flow is controlled to an proper value by an AMLOC energy saving system according to the flow load.
Reference specifications
Dew point temperature | -73°C (under pressure) | -40°C (under pressure) |
---|---|---|
Inlet air flow | 26∼264 NL/min | 34∼420 NL/min |
Inlet air pressure | 0.41∼0.99MPa | 0.41∼0.99MPa |
Inlet air temperature | 10∼49°C | 10∼49°C |