Dry-Laminator & Iso-bonder (Dry-type press with special elastic head)
Dry-Laminator (Dry-type press with special elastic head)
Uneven substrate or cavity package can be pressed under vacuum condition in a dry atmospherics.
The system can be used for bonding multichip.
- Applications
- Features
- Reference materials
- Performance comparison
- Case example of mounting special elastic head to the existing press
- Operation and principles
Applications
- Simultaneous bonding of mounted electronic components (flip-chip package)
- Voidless lamination of sealing resin
- Compression forming of ceramic substrate with cavity
- Thermal compression bonding of LCP (Liquid Crystal Polymer) module substrate for low transmission loss application.
Features
- Uniform pressurization (Using a special elastomer for press head, Dry-Laminator enables uniform pressurization that cannot be achieved by a conventional mechanical press.)
Reference specifications
| Maximum surface pressure | 10MPa | |
|---|---|---|
| MaximumTemperature | 300°C | |
| Work size | 400mm | |
| Dimensions | 1,590(W) × 1,990(H) × 2,035(D)mm | |
Performance comparison
Example of mounting an elastic head to the existing press
Operation and principles
