In the sintering process of power semiconductor modules, this equipment uses a unique 3D press method to sinter bonding chips and substrates. This new technology that replaces conventional solder materials, realizing 3D pressure using our special elastomer. Chips and substrates with different heights can be evenly bonded together, making it possible to manufacture modules more efficiently and with higher quality than the conventional method of pressing on a flat surface.
●Sinter bonding of SiC power modules
●3D uniform pressure using the special elastomer
●Uniform pressurization not only under the chip but also including the fillet part
●Running costs are reduced because there is no need to change molds for each type of substrate or chip.
Guidance of the demonstration
We have a demonstration room at Higashi-Murayama Plant we conduct customers sample test.Please feel free to ask anything.